Tube Investments of India
 
Tube Investments of India
Tube Investments of India Ltd.
Formerly TI Financial Holdings Ltd.
TII in international fora
 

Following technical papers have been presented by TII engineers in various national and international conferences.

  1. Thermal Processing of Welded Steel Tubes – An Opportunity for Designing Light Weight Components, ASM heat treat 2009, September 14-17, 2009, Indianapolis, USA. Technical paper was presented by Dr.P.Shanmugam.
  2. Heat treating of smaller parts- An insight into Vacuum Carbonitriding process, ASM heat treat 2009, September 14-17, 2009, Indianapolis, USA. Presented by Dr.P.Shanmugam
  3. Residual Stress Assessment in Chain plates due to ball drifting, Enginsoft International Conference held at Bergamo, Italy, October 1st and 2nd, 2009. Technical paper was presented by Mr.Simhachalam Bade.

    Residual Stress Assessment in Chain plates due to ball drifting, Enginsoft International Conference held at Bergamo, Italy, Technical paper was presented by Mr.Simhachalam Bade
  4. Finite Element Analysis and Experimentation of External Pin-Tube Drawing Operations, Altair HyperWorks Technology Conference 2009 (HTC09) -India/ASEAN in Pune between 14-16 September 2009. Presentation made by Mr.M.Sendil Kumar.
  5. Structural Analysis of Electric Bike Frames, Altair HyperWorks Technology Conference 2009 (HTC09) -India/ASEAN conference. Pune between 14-16 September 2009. Presented by Mr.Diwakar

    Structural Analysis of Electric Bike Frames, Altair HyperWorks Technology Conference 2009 (HTC09) -India/ASEAN conference. Presented by Mr.Diwakar
  6. Studies of tube drawing, tube sinking and tube extrusion process using finite element analysis, International conference - NAFEMS World Congress 2009, in Crete, Greece from June 16-19, 2009. Presented by Mr.M.Sendil Kumar

    Studies of tube drawing, tube sinking and tube extrusion process using finite element analysis, International conference - NAFEMS World Congress 2009, in Crete, Greece. Presented by Mr.M.Sendil Kumar
  7. Inspection of assembly stress in a chain plate and bush assembly, using reflection photo-elasticity in the ICEM 2009 (the 4th International Conference on Experimental Mechanics -18th~20th Nov.) in Singapore. Presented by Mr.N.Dasari.

    Inspection of assembly stress in a chain plate and bush assembly, using reflection photo-elasticity in the ICEM 2009 in Singapore. Presented by Mr.N.Dasari.